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Design Feature:
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(1) Quadrilaterals with dark surfaces or parts of surfaces
(2) Other irregular parallelograms, trapezia and quadrilaterals, quadrilaterals containing one or more rounded corners
(3) Several quadrilaterals juxtaposed, joined or intersecting
(4) Letters presenting a special form of writing
(5) Letters linked to or containing a figurative element -- Note: Letters representing a human being or a part of the human body, an animal or a part of an animal's body, a plant, a heavenly body, a natural phenomenon or an object are classified in division 27.3.
(6) Inscriptions in Chinese, Japanese or Korean characters
(7) Red, pink, orange
(8) Yellow, gold
(9) White, grey, silver
(10) Black
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Goods and Services Information
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Description:
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(1) - Molybdenum; tungsten
(2) - Refractory metals, their alloys and metallic composite materials in form of metal powders; wrought products made of these materials, namely wires, rods, sheets plates, bars, strips, billets, tubes, foils, ingots, rings and other shapes.
(3) - Electrodes for electrical discharge machines; parts for coating machines, namely sputtering targets, arc cathodes, electrodes and nozzles for plasma spraying machines; electrical contacts; welding electrodes; cathodes and anodes for use in electric equipment; switches for power transmission and distribution; components for electrical capacitors, namely pins, wires and formed parts; electrical parts for electrical light fixtures, namely electrodes, electrical core wires, electrical support wires, electrical conducting pins, electrical conductors and electrical crimp connections; components for glass manufacturing installations, namely glass melting electrodes; components for thermal installations, namely hot zones, thermal shielding, heating elements, charge supports, crucibles, evaporation coils, evaporation-boats, sinter-boats; filaments for electrical light fixtures and lamps; Components for ion implanters, namely screens and parts for chambers as parts of the machine; support plates for semiconducting components; semiconductor base plates; heat sinks and substrate supports for use in electronic components; components for physical apparatus, namely, filaments, arc slits, holders, cathodes, end stations, analyzer components and spare parts.
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